Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16516966
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Filing Dt:
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07/19/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Inventors:
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Noor E.V. Mohamed, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu
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Title:
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3D IC POWER GRID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| D. KENT STIER |
| MERCHANT & GOULD P.C. |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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