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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11081468
Issue Dt:
08/03/2021
Application #:
16553549
Filing Dt:
08/28/2019
Publication #:
20210066247
Pub Dt:
03/04/2021
Inventors:
Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri, Satoshi Isa
Title:
STACKED DIE PACKAGE INCLUDING A FIRST DIE COUPLED TO A SUBSTRATE THROUGH DIRECT CHIP ATTACHMENT AND A SECOND DIE COUPLED TO THE SUBSTRATE THROUGH WIRE BONDING AND RELATED METHODS, DEVICES AND APPARATUSES
Assignment: 1
Reel/Frame:
050198/0938Recorded: 08/28/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FUJISAWA, HIROKI
Exec Dt:
08/28/2019
BANSAL, RAJ K.
Exec Dt:
08/26/2019
KUWAHARA, SHUNJI
Exec Dt:
08/26/2019
KATAGIRI, MITSUAKI
Exec Dt:
08/23/2019
ISA, SATPSJO
Exec Dt:
08/23/2019
Assignee:
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY
MAILSTOP 1-507
BOISE, IDAHO 83707-0006
Correspondent:
TRASK BRITT, P.C./ MICRON TECHNOLOGY
P.O. BOX 2550
SALT LAKE CITY, UT 84110
Assignment: 2
Reel/Frame:
050235/0100Recorded: 08/29/2019Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 5TH INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 50198 FRAME: 938. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
FUJISAWA, HIROKI
Exec Dt:
08/28/2019
BANSAL, RAJ K.
Exec Dt:
08/26/2019
KUWAHARA, SHUNJI
Exec Dt:
08/26/2019
KATAGIRI, MITSUAKI
Exec Dt:
08/23/2019
ISA, SATOSHI
Exec Dt:
08/23/2019
Assignee:
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY
MAILSTOP 1-507
BOISE, IDAHO 83707-0006
Correspondent:
TRASK BRITT P.C./ MICRON TECHNOLOGY
P.O. BOX 2550
SALT LAKE CITY, UT 84110

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