Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16530757
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Filing Dt:
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08/02/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventors:
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Chan H. Yoo, George E. Pax, Yogesh Sharma, Gregory A. King, Thomas H. Kinsley et al
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Title:
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MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR THERMAL MANAGEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP - MICRON PATENT-SEA |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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