Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16795095
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Filing Dt:
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02/19/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Inventors:
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Stefan Buhl, Philip Groeger, Patrick Lomtscher
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Title:
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Wafer Exposure Method Using Wafer Models and Wafer Fabrication Assembly
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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DR.-KUELZ-RING 15 |
DRESDEN, GERMANY 01067 |
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HODGSON RUSS LLP |
140 PEARL STREET |
SUITE 100 |
BUFFALO, NY 14202-4040 |
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