Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16764971
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Filing Dt:
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05/18/2020
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Publication #:
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Pub Dt:
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11/05/2020
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Inventor:
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Hisato MICHIKOSHI
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Title:
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SEMICONDUCTOR APPARATUS INCLUDING LEADS AND BONDING WIRES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, |
| OSAKA, JAPAN 541-0041 |
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| IPUSA, P.L.L.C |
| 1054 31ST STREET, N.W. |
| SUITE 400 |
| WASHINGTON, DC 20007 |
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