Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16604715
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Filing Dt:
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10/11/2019
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Inventors:
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Mingzhu WANG, Takehiko TANAKA, Zhenyu CHEN, Nan GUO, Bojie ZHAO
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Title:
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CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68 SHUNYU ROAD, YUYAO NINGBO |
| ZHEJIANG, CHINA 315-400 |
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| WENDEROTH, LIND & PONACK, LLP. |
| 1025 CONNECTICUT AVENUE, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20036 |
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