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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/24/2021
Application #:
16444252
Filing Dt:
06/18/2019
Publication #:
Pub Dt:
02/13/2020
Inventors:
Jin-young Lim, Jae-ho Park, Sang-hoon Baek, Dal-hee Lee, Hyeon-gyu You
Title:
INTEGRATED CIRCUIT INCLUDING MULTIPLE-HEIGHT CELL AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
049503/0399Recorded: 06/18/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/17/2019
Exec Dt:
01/17/2019
Exec Dt:
01/17/2019
Exec Dt:
01/17/2019
Exec Dt:
01/17/2019
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
MYERS BIGEL, P.A.
PO BOX 37428
RALEIGH, NC 27627

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