Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/2021
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Application #:
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16387759
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Filing Dt:
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04/18/2019
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Publication #:
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Pub Dt:
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10/22/2020
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Inventors:
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Xinrui NIU, Bo XU
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Title:
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MEDIUM FOR BINDING COMPONENTS IN AN ASSEMBLY OF AN ELECTRONIC DEVICE, A METHOD OF PREPARING THE SAME, A DISPLAY ASSEMBLY OF AN ELECTRONIC DEVICE, AND A SYSTEM FOR SIMULATING MECHANICAL BEHAVIOURS OF THE ELECTRONIC DEVICE AND THE MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 83 TAT CHEE AVENUE |
| KOWLOON, HONG KONG |
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| RENNER KENNER GREIVE BOBAK TAYLOR & WEBE |
| HUNTINGTON TOWER, SUITE 400 |
| 106 SOUTH MAIN STREET |
| AKRON, OH 44308-1412 |
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