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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11121073
Issue Dt:
09/14/2021
Application #:
15943565
Filing Dt:
04/02/2018
Publication #:
20190304897
Pub Dt:
10/03/2019
Inventors:
Travis LAJOIE, Abhishek SHARMA, Juan ALZATE-VINASCO, Chieh-Jen KU, Shem OGADHOH et al
Title:
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
Assignment: 1
Reel/Frame:
047942/0691Recorded: 01/09/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAJOIE, TRAVIS
Exec Dt:
04/13/2018
SHARMA, ABHISHEK
Exec Dt:
04/13/2018
ALZATE-VINASCO, JUAN
Exec Dt:
04/13/2018
KU, CHIEH-JEN
Exec Dt:
04/13/2018
OGADHOH, SHEM
Exec Dt:
04/13/2018
GARDINER, ALLEN
Exec Dt:
04/13/2018
LIN, BLAKE
Exec Dt:
04/13/2018
WANG, YIH
Exec Dt:
04/13/2018
WANG, PEI-HUA
Exec Dt:
04/13/2018
KAVALIEROS, JACK T.
Exec Dt:
04/16/2018
SELL, BERNHARD
Exec Dt:
04/13/2018
GHANI, TAHIR
Exec Dt:
04/13/2018
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH AVENUE, STE. 1600
PORTLAND, OR 97204

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