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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11121127
Issue Dt:
09/14/2021
Application #:
16589773
Filing Dt:
10/01/2019
Publication #:
20200235091
Pub Dt:
07/23/2020
Inventors:
Jun-gu KANG, Young-mok Kim, Woon-bae Kim, Dae-cheol Seong, Yune-seok Chung
Title:
INTEGRATED CIRCUIT CHIPS, INTEGRATED CIRCUIT PACKAGES INCLUDING THE INTEGRATED CIRCUIT CHIPS, AND DISPLAY APPARATUSES INCLUDING THE INTEGRATED CIRCUIT CHIPS
Assignment: 1
Reel/Frame:
050606/0134Recorded: 10/02/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KANG, JUNG-GU
Exec Dt:
06/21/2019
KIM, YOUNG-MOK
Exec Dt:
06/21/2019
KIM, WOON-BAE
Exec Dt:
08/16/2019
SEONG, DAE-CHEOL
Exec Dt:
09/25/2019
CHUNG, YUNE-SEOK
Exec Dt:
08/07/2019
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195
Assignment: 2
Reel/Frame:
056774/0257Recorded: 07/07/2021Pages: 4
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
KANG, JUN-GU
Exec Dt:
07/01/2021
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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