Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/21/2021
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Application #:
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16393073
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Filing Dt:
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04/24/2019
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Publication #:
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Pub Dt:
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05/28/2020
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Inventors:
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Jun Gul Hwang, Sung Keun Park, Gun Lee, Ji Eun Woo
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY BY ADDING THE FOURTH ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 0490777 FRAME: 0881. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| SUGHRUE MION PLLC |
| 2000 PENNSYLVANIA AVE, N.W. |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20004 |
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