Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/28/2021
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Application #:
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16170195
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Filing Dt:
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10/25/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Inventors:
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Yingcong Deng, Andrzej Przybylski, Dandan Zhang, Fengchun Xie, Roberto Francisco-Yi Lu et al
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Title:
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Assembly System
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SECTIONS F AND G, LEVEL 1, BUILDING 15 |
| NO. 999 YINGLUN ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE |
| SHANGHAI, CHINA |
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| 19, CYBERNETYKI STREET |
| WARSAW, POLAND 02-677 |
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| 1050 WESTLAKES DRIVE |
| BERWYN, PENNSYLVANIA 19312 |
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| BUILDING 6, 928 CHANGJIANG ROAD (N) |
| JIANGSU |
| KUNSHAN CITY, CHINA |
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| BARLEY SNYDER |
| 2 GREAT VALLEY PARKWAY |
| SUITE 110 |
| MALVERN, PA 19355 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MUEHLENSTRASSE 26 |
| SCHAFFHAUSEN, SWITZERLAND 8200 |
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| TE CONNECTIVITY CORPORATION C/O THE WHIT |
| 4550 LINDEN HILL ROAD |
| SUITE 140 |
| WILMINGTON, DE 19808 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| MUEHLENSTRASSE 26 |
| SCHAFFHAUSEN, SWITZERLAND 8200 |
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| TE CONNECTIVITY CORPORATION C/O THE WHIT |
| 4550 LINDEN HILL ROAD |
| SUITE 140 |
| WILMINGTON, DE 19808 |
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