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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11136437	Issue Dt:	10/05/2021	Application #:	16324018	Filing Dt:	02/07/2019
Publication #:	20190177488	Pub Dt:	06/13/2019
Inventor:	Ryosuke YAMAZAKI
Title:	CURABLE PARTICULATE SILICONE COMPOSITION, SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION, AND METHOD FOR MOLDING SEMICONDUCTOR MEMBER

Assignment: 1

Reel/Frame:

057128/0566

Recorded: 08/10/2021

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignor:

YAMAZAKI, RYOSUKE

Exec Dt:

01/24/2019

Assignee:

DOW CORNING TORAY CO., LTD.

5-1, OTEMACHI 1-CHOME

CHIYODA-KU, TOKYO, JAPAN 100-0004

Correspondent:

WARNER NORCROSS + JUDD LLP

150 OTTAWA AVE NW

SUITE 1500

GRAND RAPIDS, MI 49503-2832

Assignment: 2

Reel/Frame:

051322/0925

Recorded: 05/17/2019

Pages: 26

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignor:

DOW CORNING TORAY CO., LTD.

Exec Dt:

02/01/2019

Assignee:

DOW TORAY CO., LTD.

2-24, HIGASHISHINAGAWA 2- CHOME

SHINAGAWA-KU, TOKYO, JAPAN 140-8617

Correspondent:

WARNER NORCROSS & JUDD LLP

900 FIFTH THIRD CENTER

111 LYON STREET, N.W.

GRAND RAPIDS, MI 49503-2487

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