Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16489790
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Filing Dt:
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08/29/2019
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Publication #:
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Pub Dt:
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01/09/2020
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Inventors:
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Munetoshi IRISAWA, Kunihito KAJIYA, Yuji TOYODA
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, ETCHING METHOD AND PLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-10-14, RYOGOKU, SUMIDA-KU |
| TOKYO, JAPAN 130-0026 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1025 CONNECTICUT AVENUE NW |
| SUITE 500 |
| WASHINGTON, DC 20036 |
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