Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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15570208
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Filing Dt:
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10/27/2017
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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Shinichi TABATA, Mitsuru SHIOKAWA
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Title:
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LIQUID BLOW MOLDING APPARATUS AND LIQUID BLOW MOLDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| THURGAUERSTRASSE 34 |
| ZURICH, SWITZERLAND CH-8050 |
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| HONIGMAN MILLER SCHWARTZ AND COHN LLP |
| 315 EAST EISENHOWER PARKWAY, SUITE 100 |
| ANN ARBOR, MI 48108 |
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