Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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16739001
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Filing Dt:
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01/09/2020
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Publication #:
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Pub Dt:
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09/17/2020
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Inventor:
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Florian G. HERRAULT
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Title:
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METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3011 MALIBU CANYON ROAD |
| MALIBU, CALIFORNIA 90265 |
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| LADAS & PARRY LLP |
| 4525 WILSHIRE BOULEVARD, SUITE 240 |
| LOS ANGELES, CA 90010 |
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