Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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17028618
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Seok Kim Tay, Robin Zhang, Mikael Tuominen, Sally Sun
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Title:
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Component Carrier With Through Hole Extending Through Multiple Dielectric Layers
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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FABRIKSGASSE 13 |
LEOBEN, AUSTRIA 8700 |
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SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
50 GLENLAKE PARKWAY, SUITE 340 |
ATLANTA, GA 30328 |
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