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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11163216
Issue Dt:
11/02/2021
Application #:
16855988
Filing Dt:
04/22/2020
Publication #:
20210055629
Pub Dt:
02/25/2021
Inventors:
Mingzhu WANG, Takehiko Tanaka, Nan GUO, Duanliang CHENG, Feifan CHEN, Bojie ZHAO et al
Title:
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
Assignment: 1
Reel/Frame:
054670/0512Recorded: 12/10/2020Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
05/06/2020
ZHAO, BOJIE
Exec Dt:
05/06/2020
TANAKA, TAKEHIKO
Exec Dt:
05/04/2020
CHEN, ZHENYU Y
Exec Dt:
05/04/2020
GUO, NAN
Exec Dt:
05/04/2020
HUANG, ZHEN
Exec Dt:
05/04/2020
CHENG, DUANLIANG
Exec Dt:
05/08/2020
DING, LIANG
Exec Dt:
05/04/2020
CHEN, FEIFAN
Exec Dt:
04/30/2020
JIANG, HENG
Exec Dt:
05/04/2020
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68 SHUNYU ROAD,
YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400
Correspondent:
RAYMOND Y CHAN
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754
Assignment: 2
Reel/Frame:
054758/0944Recorded: 12/15/2020Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
05/06/2020
ZHAO, BOJIE
Exec Dt:
05/06/2020
TANAKA, TAKEHIKO
Exec Dt:
05/04/2020
CHEN, ZHENYU
Exec Dt:
05/04/2020
GUO, NAN
Exec Dt:
05/04/2020
HUANG, ZHEN
Exec Dt:
05/04/2020
CHENG, DUANLIANG
Exec Dt:
05/08/2020
DING, LIANG
Exec Dt:
05/04/2020
CHEN, FEIFAN
Exec Dt:
04/30/2020
JIANG, HENG
Exec Dt:
05/04/2020
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68 SHUNYU ROAD,
YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400
Correspondent:
DAVID AND RAYMOND PATENT FIRM
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

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