Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16359125
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Filing Dt:
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03/20/2019
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Karsten Bruening, Jun Amano
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Title:
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FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CONDUCTIVE RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2855 CAMPUS DRIVE, SUITE 100 |
SAN MATEO, CALIFORNIA 94403 |
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YING CHEN CHEN YOSHIMURA LLP |
750 W HAMILTON AVE |
UNIT C |
SAN PEDRO, CA 90731 |
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