Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/09/2021
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Application #:
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16491678
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Filing Dt:
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09/06/2019
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Publication #:
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Pub Dt:
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01/30/2020
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Inventors:
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Koichi YATSUDA, Takashi HAYAKAWA, Mitsuaki IWASHITA, Takashi TANAKA
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Title:
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METHOD FOR MANUFACTURING A CONTACT PAD, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, AKASAKA 5-CHOME, MINATO-KU, |
| TOKYO, JAPAN 107-6325 |
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| IPUSA, P.L.L.C |
| 1054 31ST STREET, N.W. |
| SUITE 400 |
| WASHINGTON, DC 20007 |
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