Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16017393
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Filing Dt:
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06/25/2018
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Publication #:
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Pub Dt:
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12/26/2019
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Inventors:
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Suddhasattwa NAD, Marcel WALL, Rahul MANEPALLI
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Title:
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PACKAGE ARCHITECTURE WITH IMPROVED VIA DRILL PROCESS AND METHOD FOR FORMING SUCH PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWABE, WILLIAMSON, & WYATT |
| 1211 SW 5TH AVENUE |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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