Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16807677
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Filing Dt:
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03/03/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Inventors:
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Takashi KAWAMURA, Masato ISHIZAKI, Naoki GOTOU
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Title:
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CONNECTION STRUCTURE FOR WIRING SUBSTRATE AND FLEXIBLE SUBSTRATE AND PACKAGE FOR HOUSING ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2701-1, AZA IWAKURA, OMINECHO HIGASHIBUN |
| MINE-SHI, YAMAGUCHI, JAPAN 759-2212 |
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-CITY, PREFECTURE, JAPAN 467-8530 |
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| BURR & BROWN, PLLC |
| PO BOX 869 |
| FAYETTEVILLE, NY 13066 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR'S LAST NAME AND THE SECOND ASSIGNEE'S CITY PREVIOUSLY RECORDED ON REEL 052149 FRAME 0941. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2701-1, AZA IWAKURA, OMINECHO HIGASHIBUN |
| MINE-SHI, YAMAGUCHI, JAPAN 759-2212 |
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-CITY, AICHI-PREFECTURE, JAPAN 467-8530 |
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| BURR & BROWN, PLLC |
| PO BOX 869 |
| FAYETTEVILLE, NY 13066 |
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