Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16769426
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Filing Dt:
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06/03/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Hiroyoshi Kawasaki, Daisuke Soma
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Title:
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Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, Formed Solder, and Method for Manufacturing Cu Ball
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| THE WEBB LAW FIRM, P.C. |
| ONE GATEWAY CENTER |
| 420 FT. DUQUESNE BLVD, SUITE 1200 |
| PITTSBURGH, PA 15222 |
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