Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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15764025
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Filing Dt:
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03/28/2018
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Publication #:
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Pub Dt:
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10/25/2018
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Inventors:
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Ryohei KASAI, Tadashi FURUKAWA, Ryo FURUGEN, Teppei SOTODA, Tetsushi HOSODA, Ayako FURUSE
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Title:
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WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, METHOD OF FORMING PATTERN STRUCTURE, IMPRINT MOLD AND METHOD OF MANUFACTURING THE SAME, IMPRINT MOLD SET, AND METHOD OF MANUFACTURING MULTILAYER WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, ICHIGAYA-KAGA-CHO 1-CHOME |
| SHINJUKU-KU |
| TOKYO-TO, JAPAN |
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| JAMES A. OLIFF |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1694 HIGHLAND AVE. |
| ROCHESTER, NEW YORK 14618 |
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| RALPH K. MERZBACH, ESQ. |
| 73 STATE ST. |
| ROCHESTER, NY 14614 |
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