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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11192979
Issue Dt:
12/07/2021
Application #:
16495254
Filing Dt:
09/18/2019
Publication #:
20200087458
Pub Dt:
03/19/2020
Inventors:
Shinji IEDA, Hisho YAMADA, Takayuki WAKITA, Kimiaki KAWATANI, Yoshikimi KONDO et al
Title:
POLYAMIDE COMPOSITION AND MOLDED ARTICLE
Assignment: 1
Reel/Frame:
050802/0319Recorded: 10/23/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
IEDA, SHINJI
Exec Dt:
08/28/2019
NAGASE, KOICHI
Exec Dt:
08/29/2019
YAMADA, HISHO
Exec Dt:
09/02/2019
MIKAMI, JUN
Exec Dt:
08/28/2019
WAKITA, TAKAYUKI
Exec Dt:
09/06/2019
ARAKI, YOSHIFUMI
Exec Dt:
09/09/2019
KAWATANI, KIMIAKI
Exec Dt:
09/03/2019
OKUMURA, TOMOYO
Exec Dt:
09/02/2019
KONDO, YOSHIKIMI
Exec Dt:
09/12/2019
TERADA, KAZUNORI
Exec Dt:
08/28/2019
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
1-1-2 YURAKUCHO, CHIYODA-KU
TOKYO, JAPAN 100-0006
Correspondent:
GREENBLUM & BERNSTEIN P.L.C.
1950 ROLAND CLARKE PL
RESTON, VA 20191

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