Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/07/2021
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Application #:
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16893440
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Filing Dt:
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06/05/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee et al
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING SHIELDING PLATE IN REDISTRIBUTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE VIA IN REDISTRIBUTION STRUCTURE, AND
MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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