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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11201142
Issue Dt:
12/14/2021
Application #:
15660968
Filing Dt:
07/27/2017
Publication #:
20190035772
Pub Dt:
01/31/2019
Inventors:
Li-Hsien Huang, Chen-Hua Yu, Hua-Wei Tseng, Yi-Jen Lai, Chi-Hsi Wu, Der-Chyang Yeh et al
Title:
SEMICONDCUTOR PACKAGE, PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FROMING PACKAGE ON PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
043301/0415Recorded: 08/15/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, LI-HSIEN
Exec Dt:
07/20/2017
WU, CHI-HSI
Exec Dt:
07/24/2017
YU, CHEN-HUA
Exec Dt:
07/24/2017
YEH, DER-CHYANG
Exec Dt:
07/21/2017
TSENG, HUA-WEI
Exec Dt:
07/20/2017
YEW, MING-CHIH
Exec Dt:
07/24/2017
LAI, YI-JEN
Exec Dt:
07/27/2017
YEH, MING-SHIH
Exec Dt:
07/31/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
2F, NO. 13, INNOVATION ROAD I, SCIENCE-BASED INDUS
HSINCHU, TAIWAN

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