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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/28/2021
Application #:
16473778
Filing Dt:
06/26/2019
Publication #:
Pub Dt:
11/07/2019
Inventors:
Yeong Deuk SEO, Jee Kwon PARK, Jung Ki KIM, Yoo Jin JUNG, Sang Hyun HONG
Title:
Thermally-Conductive Resin Composition, and Complex Comprising Same
Assignment: 1
Reel/Frame:
049594/0246Recorded: 06/26/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2019
Exec Dt:
06/20/2019
Exec Dt:
06/20/2019
Exec Dt:
06/20/2019
Exec Dt:
06/20/2019
Assignee:
334-27, YEOSUSANDAN-RO
YEOSU-SI, JEOLLANAM-DO
YEOSU-SI, KOREA, REPUBLIC OF 59616
Correspondent:
ADDITON, HIGGINS & PENDLETON, P.A.
10706 SIKES PLACE
SUITE 350
CHARLOTTE, NC 28277

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