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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/28/2021
Application #:
16991123
Filing Dt:
08/12/2020
Publication #:
Pub Dt:
02/25/2021
Inventors:
Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong et al
Title:
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package
Assignment: 1
Reel/Frame:
053956/0076Recorded: 10/02/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/01/2020
Exec Dt:
08/14/2020
Exec Dt:
08/21/2020
Exec Dt:
08/14/2020
Exec Dt:
08/14/2020
Exec Dt:
09/24/2020
Exec Dt:
09/24/2020
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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