Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/11/2022
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Application #:
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16106007
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Filing Dt:
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08/21/2018
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Publication #:
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Pub Dt:
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09/26/2019
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Inventors:
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Shu-Han WU, Qi-Ming HUANG, Yun-Chung SUN, Hung-Wen CHEN, Yang-Hao CHOU
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Title:
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SOLDERING PROCESS METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.252, SHANYING RD., GUISHAN DIST. |
| TAOYUAN CITY, TAIWAN 333 |
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| CKC & PARTNERS CO., LTD. |
| ROOM 1901, 19/F, LEE GARDEN ONE, |
| 33 HYSAN AVENUE, CAUSEWAY BAY, |
| HONG KONG, HONG KONG |
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