Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/11/2022
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Application #:
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16543628
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Filing Dt:
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08/19/2019
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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XIJUN GUO, JIANHUA CHEN, HAIPENG ZHU, XIANLEI ZHANG, Min-Hsien Chen, Ching-Ning Yang et al
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Title:
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METHOD FOR DEPOSITING A METAL LAYER ON A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.899 WAN JIA CHUN ROAD, XIAMEN XIANG'AN |
| XIAMEN, FUJIAN, CHINA |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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