Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/18/2022
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Application #:
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16354501
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Filing Dt:
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03/15/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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Takayuki TAJIMA, Kazuo SHIMOKAWA
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Title:
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SEMICONDUCTOR DEVICE HAVING CHIP STACKED AND MOLDED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-21, SHIBAURA 3-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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