Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16904685
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Filing Dt:
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06/18/2020
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Sunyong Lee, Tae Hyeob Im, Sarah Eunkyung Kim
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Title:
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SEMICONDUCTOR DEVICE PACKAGE COMPRISING THERMAL INTERFACE LAYER AND METHOD OF FABRICATING OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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232, GONGNEUNG-RO, NOWON-GU |
SEOUL, KOREA, REPUBLIC OF 01811 |
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FINCH & MALONEY PLLC |
50 COMMERCIAL STREET |
SUITE 300 |
MANCHESTER, NH 03101 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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55, HANYANGDEAHAK-RO, SANGROK-GU |
ANSAN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 15588 |
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FINCH & MALONEY PLLC |
50 COMMERCIAL STREET |
SUITE 300 |
MANCHESTER, NH 03101 |
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05/30/2024 06:04 PM
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