Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16954020
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Filing Dt:
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06/15/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Keiko KASHIHARA, Rihoko WATANABE, Hiroharu INOUE
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Title:
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PREPREG, SUBSTRATE, METAL-CLAD LAMINATE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 540-6207 |
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| PASONA KNOWLEDGE PARTNER INC. |
| 8F OBP PANASONIC TOWER |
| 1-61, SHIROMI 2-CHOME, CHUO-KU |
| OSAKA, 540-6208 JAPAN |
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