Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16227861
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Filing Dt:
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12/20/2018
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Publication #:
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Pub Dt:
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06/20/2019
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Inventor:
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Xiaochun Tan
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Title:
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CHIP PACKAGING STRUCTURE WITH HEAT DISSIPATION LAYER, FLANGE AND SEALING PIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3699, XIYOU ROAD, HIGH-TECH ZONE |
| HEFEI CITY, CHINA 230000 |
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| JUDSON K. CHAMPLIN |
| 900 SECOND AVENUE SOUTH |
| SUITE 1400 |
| MINNEAPOLIS, MN 55402 |
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