Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16703252
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Filing Dt:
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12/04/2019
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Publication #:
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Pub Dt:
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06/10/2021
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Inventors:
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Mukta Ghate Farooq, Ravi K. Bonam, Spyridon Skordas, James J. Kelly
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Title:
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Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips and Packaging Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MICHAEL J. CHANG |
| 84 SUMMIT AVENUE |
| MICHAEL J. CHANG, LLC |
| MILFORD, CT 06460 |
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