Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16093091
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Filing Dt:
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10/11/2018
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Yuo UMEI, Susumu SUGANO, Kazuharu YASUDA, Hideaki ICHIKI
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Title:
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MOLDING DIE AND COMPRESSION MOLDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-105, KANDA JINBOCHO, CHIYODA-KU |
| TOKYO, JAPAN 101-8101 |
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| ROBERT SMYTH |
| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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