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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/08/2022
Application #:
17097033
Filing Dt:
11/13/2020
Publication #:
Pub Dt:
06/10/2021
Inventors:
Chih-Hung BAI, Yao-Tsung CHEN, Zong-Cyuan CHEN, Shih-Chun CHUNG
Title:
NANO-TWINNED COPPER LAYER, METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE COMPRISING THE SAME
Assignment: 1
Reel/Frame:
054356/0211Recorded: 11/13/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/23/2020
Exec Dt:
10/23/2020
Exec Dt:
10/26/2020
Exec Dt:
10/23/2020
Assignee:
NO. 4-2, GUANGFU RD.
HSINCHU INDUSTRIAL PARK
HSINCHU COUNTY, TAIWAN 303
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314-1176

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