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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/08/2022
Application #:
15910288
Filing Dt:
03/02/2018
Publication #:
Pub Dt:
09/05/2019
Inventors:
Ying WANG, Cheng XU, Chong ZHANG, Yikang DENG, Junnan ZHAO
Title:
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUND PTH IN IC PACKAGE SUBSTRATE
Assignment: 1
Reel/Frame:
045173/0533Recorded: 03/12/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/01/2018
Exec Dt:
03/01/2018
Exec Dt:
03/01/2018
Exec Dt:
03/01/2018
Exec Dt:
03/01/2018
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH, STE. 1900
PORTLAND, OR 97204

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