Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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16576258
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Filing Dt:
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09/19/2019
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Inventors:
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Fuh-Sheng Shieu, Hong-Ta Yang, Hsiang-Ting Wang, Tzong-Ming Wu, Wei-Ping Dow et al
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Title:
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Composite with Hollow Nano-Structures and Application Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 145 XINGDA RD., SOUTH DIST. |
| TAICHUNG CITY 402, TAIWAN ROC |
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| MAYER & WILLIAMS, P.C. |
| 55 MADISON AVENUE, SUITE 400 |
| MORRISTOWN, NJ 07960 |
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