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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	11254029	Issue Dt:	02/22/2022	Application #:	16701884	Filing Dt:	12/03/2019
Inventors:	Yoshihiro KAWAGUCHI, Takayuki MASADA, Tomohito MATSUDA, Susumu INAKAZU, Naoya TAKESUE et al
Title:	WAFER DIVIDING APPARATUS

Assignment: 1

Reel/Frame:

051164/0235

Recorded: 12/03/2019

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

MASADA, TAKAYUKI

Exec Dt:

12/02/2019

KAWAGUCHI, YOSHIHIRO

Exec Dt:

12/02/2019

MATSUDA, TOMOHITO

Exec Dt:

12/02/2019

FUJII, YUHEI

Exec Dt:

12/02/2019

INAKAZU, SUSUMU

Exec Dt:

12/02/2019

SAITO, RYOTA

Exec Dt:

12/02/2019

TAKESUE, NAOYA

Exec Dt:

12/02/2019

ISHIDA, HIDEAKI

Exec Dt:

12/02/2019

Assignee:

DISCO CORPORATION

13-11, OMORI-KITA 2-CHOME, OTA-KU,

TOKYO, JAPAN 143-8580

Correspondent:

GREER, BURNS & CRAIN, LTD

300 S. WACKER DR.

SUITE 2500

CHICAGO, IL 60606

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