Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16745705
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Filing Dt:
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01/17/2020
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Inventors:
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Tsung-Te CHIU, Bing-Han CHUANG, Houng-Chi WEI
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Title:
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METHOD FOR MANUFACTURING BACKSIDE METALIZED COMPOUND SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 753-799 MIN'AN AVENUE, HONGTANG TOWN |
| TONG'AN DISTRICT |
| XIAMEN, FUJIAN, CHINA 361100 |
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| MICHAEL BEST & FRIEDRICH LLP (MKE) |
| 100 E WISCONSIN AVENUE |
| SUITE 3300 |
| MILWAUKEE, WI 53202 |
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