Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16897424
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Filing Dt:
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06/10/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Inventors:
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TING-YING WU, CHIN-YUAN LO, CHIEN-HSIANG HUANG, CHIH-WEI CHANG
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Title:
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ELECTRONIC PACKAGE STRUCTURE WITH A CORE GROUND WIRE AND CHIP THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.2, INNOVATION ROAD II, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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