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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/08/2022
Application #:
16889304
Filing Dt:
06/01/2020
Publication #:
Pub Dt:
12/02/2021
Inventor:
Wei HAN
Title:
SCALABLE AND FLEXIBLE ARCHITECTURES FOR INTEGRATED CIRCUIT (IC) DESIGN AND FABRICATION
Assignment: 1
Reel/Frame:
052886/0527Recorded: 06/09/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/03/2020
Assignee:
FOURTH FLOOR, ONE CAPITAL PLACE
P.O. BOX 847
GEORGE TOWN, GRAND CAYMEN, CAYMAN ISLANDS
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
901 NEW YORK AVE NW
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
053595/0980Recorded: 06/10/2020Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CHANGE SPELLING OF CITY PREVIOUSLY RECORDED AT REEL: 052886 FRAME: 0527. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignor:
Exec Dt:
06/03/2020
Assignee:
FOURTH FLOOR, ONE CAPITAL PLACE
P.O. BOX 847
GEORGE TOWN, GRAND CAYMAN, CAYMAN ISLANDS
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
901 NEW YORK AVE NW
WASHINGTON, DC 20001

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