Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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16284630
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Filing Dt:
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02/25/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Inventors:
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Po-Hao TSAI, Po-Yao CHUANG, Shin-Puu JENG, Ming-Chih YEW, Shuo-Mao CHEN
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Title:
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STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH SHIELDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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BIRCH STEWART KOLASCH & BIRCH LLP |
8110 GATEHOUSE ROAD SUITE 100E |
FALLS CHURCH, VA 22042 |
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