Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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17006316
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Filing Dt:
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08/28/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Inventors:
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John Vesce III, Joseph William Heery JR.
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Title:
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THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200 EAST SANDPOINTE |
| SUITE 400 |
| SANTA ANA, CALIFORNIA 92707 |
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| POLSINELLI PC |
| 105 WEST VANDALIA STREET |
| SUITE 400 |
| EDWARDSVILLE, IL 62025 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY'S DATA PREVIOUSLY RECORDED AT REEL: 055498 FRAME: 0988. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 200 EAST STANDPOINTE, SUITE 400 |
| SANTA ANA, CALIFORNIA 92707 |
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| OLGA AYALA |
| 600 THIRD AVENUE |
| 42ND FLOOR |
| NEW YORK, NY 10016 |
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Assignment:
3
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PATENT SECURITY AGREEMENT (ABL)
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| 10 S. DEARBORN |
| FLOOR L2 |
| CHICAGO, ILLINOIS 60603 |
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| COURTNEY WELSHIMER |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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Assignment:
4
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PATENT SECURITY AGREEMENT (TERM LOAN)
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| 10 S. DEARBORN |
| FLOOR L2 |
| CHICAGO, ILLINOIS 60603 |
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| COURTNEY WELSHIMER |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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05/30/2024 02:08 PM
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