Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/29/2022
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Application #:
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16947477
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Filing Dt:
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08/03/2020
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Publication #:
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Pub Dt:
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02/11/2021
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Inventors:
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Mikael Tuominen, Seok Kim Tay, Nick Xin
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Title:
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Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 5000, JIN DU ROAD |
| XINZHUANG INDUSTRY PARK, MINHANG DISTRICT |
| SHANGHAI, CHINA 201108 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 50 GLENLAKE PARKWAY, SUITE 340 |
| ATLANTA, GA 30328 |
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