Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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16960002
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Filing Dt:
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07/02/2020
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Publication #:
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Pub Dt:
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12/17/2020
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Inventors:
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Motohiro ONITSUKA, Yoko KURASAWA, Hiroyoshi KAWASAKI
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Title:
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RESIN COMPOSITION FOR SOLDERING, RESIN FLUX CORED SOLDER, FLUX COATED SOLDER, AND LIQUID FLUX
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| HARNESS, DICKEY & PIERCE, PLC |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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