Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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17036271
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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Joachim Mahler, Giovanni Ragasa Garbin, Chen Wen Lee, Benjamin Reichert, Peter Strobel
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Title:
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Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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05/12/2024 01:22 PM
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