Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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16993860
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Filing Dt:
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08/14/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Inventors:
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Bret K. Street, Wei Zhou, Jonathan S. Hacker, Christopher J. Gambee, Shijian Luo
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Title:
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Die Features for Self-Alignment During Die Bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 S. FEDERAL WAY |
BOISE, IDAHO 83716 |
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PARSONS BEHLE & LATIMER - MICRON MICRON |
800 W. MAIN STREET |
SUITE 1300 |
BOISE, ID 83702 |
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05/14/2024 10:46 PM
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